| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-413-5235 (014135235) |
| NCB Code | USA (01) |
| Manufacturer | Dla Land And Maritime, Cypress Semiconductor Inc, Mercury Corporation, Austin Semiconductor Inc |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 5962-89598 | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8959820MMA | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8959820MMB | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8959820MMX | dla land and maritime | microcircuit memory | 67268 | RFQ |
| CY7C1009L-25LMB | cypress semiconductor inc | microcircuit memory | 65786 | RFQ |
| ED188130LPS25L32B | mercury corporation | microcircuit memory | 54230 | RFQ |
| MT5C1008ECA-25L883C | austin semiconductor inc | microcircuit memory | 0eu86 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | LOW POWER" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS NOMINAL ACCESS" |
| CZER | MEMORY DEVICE TYPE | RAM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | LOW POWER" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS NOMINAL ACCESS" |
| CZER | MEMORY DEVICE TYPE | RAM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |
| Components Related to NSN - 5962-01-413-5235, 5962014135235 | ||||
| 5950-00-782-4837 (5950007824837) | 5905-01-053-5779 (5905010535779) | 5962-01-037-6404 (5962010376404) | 5995-01-204-1471 (5995012041471) | |
| 5970-01-146-4146 (5970011464146) | 5975-01-393-2233 (5975013932233) | 5999-01-420-7755 (5999014207755) | 5910-00-826-2725 (5910008262725) | |
| 5998-01-303-6935 (5998013036935) | 5935-01-273-2470 (5935012732470) | 5935-01-172-3967 (5935011723967) | 5999-01-176-2149 (5999011762149) | |
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