| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-413-5235 (014135235) |
| NCB Code | USA (01) |
| Manufacturer | Dla Land And Maritime, Cypress Semiconductor Inc, Mercury Corporation, Austin Semiconductor Inc |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 5962-89598 | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8959820MMA | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8959820MMB | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8959820MMX | dla land and maritime | microcircuit memory | 67268 | RFQ |
| CY7C1009L-25LMB | cypress semiconductor inc | microcircuit memory | 65786 | RFQ |
| ED188130LPS25L32B | mercury corporation | microcircuit memory | 54230 | RFQ |
| MT5C1008ECA-25L883C | austin semiconductor inc | microcircuit memory | 0eu86 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | LOW POWER" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS NOMINAL ACCESS" |
| CZER | MEMORY DEVICE TYPE | RAM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | LOW POWER" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS NOMINAL ACCESS" |
| CZER | MEMORY DEVICE TYPE | RAM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |
| Components Related to NSN - 5962-01-413-5235, 5962014135235 | ||||
| 5905-00-502-3441 (5905005023441) | 5905-00-448-5537 (5905004485537) | 5940-00-621-2008 (5940006212008) | 5930-01-327-2312 (5930013272312) | |
| 5999-00-539-5784 (5999005395784) | 5905-01-313-7171 (5905013137171) | 5950-01-076-6980 (5950010766980) | 5965-01-571-2725 (5965015712725) | |
| 5920-01-501-5961 (5920015015961) | 5930-01-296-8547 (5930012968547) | 5996-00-048-2496 (5996000482496) | 5930-00-022-4311 (5930000224311) | |
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