Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-408-1092 (014081092) |
NCB Code | USA (01) |
Manufacturer | Dla Land And Maritime, Micron Industries Corporation, Performance Semiconductor Corp |
Part Number | Manufacturer | Item Name | Cage Code | RFQ |
---|---|---|---|---|
5962-88725 | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8872502XA | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8872502XB | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8872502XC | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8872502XX | dla land and maritime | microcircuit memory | 67268 | RFQ |
MT5C2561EC-25 | micron industries corporation | microcircuit memory | 6y440 | RFQ |
P4C1257-25LMB | performance semiconductor corp | microcircuit memory | 75569 | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.358 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.000 WATTS" |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM ABSOLUTE OUTPUT" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 4.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE" |
CZEP | CAPITANCE RATING PER CHARACTERISTIC | 12.00 OUTPUT PICOFARADS MAXIMUM" |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS" |
CZER | MEMORY DEVICE TYPE | RAM" |
CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC" |
TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS" |
ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.358 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.000 WATTS" |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM ABSOLUTE OUTPUT" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 4.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE" |
CZEP | CAPITANCE RATING PER CHARACTERISTIC | 12.00 OUTPUT PICOFARADS MAXIMUM" |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS" |
CZER | MEMORY DEVICE TYPE | RAM" |
CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC" |
TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS" |
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