Item Name | Microcircuit Linear |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-366-3028 (013663028) |
NCB Code | USA (01) |
Manufacturer | E2v Inc, Rochester Electronics Llc, Dla Land And Maritime, Advanced Micro Devices Inc |
Part Number | Manufacturer | Item Name | Cage Code | RFQ |
---|---|---|---|---|
26LS33 B2A | e2v inc | microcircuit linear | 0c7v7 | RFQ |
26LS33LM B | rochester electronics llc | microcircuit linear | 3v146 | RFQ |
5962-78020 | dla land and maritime | microcircuit linear | 67268 | RFQ |
5962-7802002M2A | dla land and maritime | microcircuit linear | 67268 | RFQ |
5962-7802002M2B | dla land and maritime | microcircuit linear | 67268 | RFQ |
5962-7802002M2X | dla land and maritime | microcircuit linear | 67268 | RFQ |
78020 | dla land and maritime | microcircuit linear | 67268 | RFQ |
78020022A | dla land and maritime | microcircuit linear | 67268 | RFQ |
78020022C | dla land and maritime | microcircuit linear | 67268 | RFQ |
78020022X | dla land and maritime | microcircuit linear | 16236 | RFQ |
78090022X | dla land and maritime | microcircuit linear | 67268 | RFQ |
AM26LS33 B2A | advanced micro devices inc | microcircuit linear | 34335 | RFQ |
AM26LS33 B2C | advanced micro devices inc | microcircuit linear | 34335 | RFQ |
AM26LS33 LMB | advanced micro devices inc | microcircuit linear | 34335 | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
CSSL | DESIGN FUNCTION AND QUANTITY | 4 RECEIVER,LINE DIFFERENTIAL |
CTQX | CURRENT RATING PER CHARACTERISTIC | 50.00 MILLIAMPERES REVERSE CURRENT,DC NOMINAL |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | DC-2 MIL-M-38510 |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
CBBL | FEATURES PROVIDED | W/ENABLE AND HIGH IMPEDANCE AND W/DISABLE AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 38.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT AND 38.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
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