Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-318-7889 (013187889) |
NCB Code | USA (01) |
Manufacturer | Omni Wave Semiconductor Corp, Rockwell Collins Aerospace, Dla Land And Maritime, White Electronic Designs Corpora, Harris Corporation, Indra Systems Inc, Integrated Device Technology Inc, Freescale Semiconductor Inc, Inova Microelectronics Corp |
Part Number | Manufacturer | Item Name | Cage Code | RFQ |
---|---|---|---|---|
0W62256CD3-10 | omni wave semiconductor corp | microcircuit memory | 0bk02 | RFQ |
351-5716-070 | rockwell collins aerospace | microcircuit memory | 13499 | RFQ |
5962-88552 | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8855201BXB | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8855201BXX | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8855201XA | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8855201XB | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8855201XX | dla land and maritime | microcircuit memory | 67268 | RFQ |
596208855201BXA | dla land and maritime | microcircuit memory | 67268 | RFQ |
995-9504-267 | rockwell collins aerospace | microcircuit memory | 13499 | RFQ |
EDH8832P-10JMHR | white electronic designs corpora | microcircuit memory | 66301 | RFQ |
I26-0021-005 | harris corporation | microcircuit memory | 14304 | RFQ |
I40AA71256L11 | indra systems inc | microcircuit memory | 0177b | RFQ |
IDT71256L100DB | integrated device technology inc | microcircuit memory | 61772 | RFQ |
MCM60256AP10 | freescale semiconductor inc | microcircuit memory | 04713 | RFQ |
MCM60256APC10 | freescale semiconductor inc | microcircuit memory | 04713 | RFQ |
S32K8L-100MC | inova microelectronics corp | microcircuit memory | 0byv4 | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.610 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.217 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND LOW POWER AND STATIC OPERATION |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | RAM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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