| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-300-0495 (013000495) |
| NCB Code | USA (01) |
| Manufacturer | Rockwell Collins Aerospace, Microchip Technology Incorporated, Dla Land And Maritime, Advanced Micro Devices Inc, Texas Instruments Inc, Waferscale Integration Inc |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 258-0197-010 | rockwell collins aerospace | microcircuit memory | 13499 | RFQ |
| 27C128-25BXA | microchip technology incorporated | microcircuit memory | 60991 | RFQ |
| 5962-87661 | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8766106BXA | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8766106BXB | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8766106BXX | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8766106XA | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8766106XB | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8766106XX | dla land and maritime | microcircuit memory | 67268 | RFQ |
| AM27C128-250 BXA | advanced micro devices inc | microcircuit memory | 34335 | RFQ |
| SMJ27C128-25JM | texas instruments inc | microcircuit memory | 01295 | RFQ |
| WS27C128L-25DMB | waferscale integration inc | microcircuit memory | 66579 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND W/ENABLE AND ULTRAVIOLET ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.6 VOLTS MINIMUM POWER SOURCE AND 6.25 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| Components Related to NSN - 5962-01-300-0495, 5962013000495 | ||||
| 5925-01-622-1713 (5925016221713) | 5950-00-224-8269 (5950002248269) | 5999-00-940-2834 (5999009402834) | 5945-00-963-1183 (5945009631183) | |
| 5940-00-615-5893 (5940006155893) | 5998-00-297-6935 (5998002976935) | 5950-00-646-2937 (5950006462937) | 5961-00-228-5860 (5961002285860) | |
| 5935-01-107-8942 (5935011078942) | 5945-01-131-3787 (5945011313787) | 5998-01-373-2457 (5998013732457) | 5950-01-276-8859 (5950012768859) | |
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