Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-298-2287 (012982287) |
NCB Code | USA (01) |
Manufacturer | Nimikkeistokeskus Ncb Finland, Rockwell Collins Aerospace, Dla Land And Maritime, Philips Semiconductors Ltd, Intel Corporation, Ems Development Corporation |
Part Number | Manufacturer | Item Name | Cage Code | RFQ |
---|---|---|---|---|
10172701 | nimikkeistokeskus ncb finland | microcircuit memory | a486g | RFQ |
351-5209-012 | rockwell collins aerospace | microcircuit memory | 13499 | RFQ |
5962-87684 | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8768401MQA | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8768401MQX | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8768401QA | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8768401QB | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-8768401QX | dla land and maritime | microcircuit memory | 67268 | RFQ |
5962-9056401XX | dla land and maritime | microcircuit memory | 67268 | RFQ |
8768401QX | dla land and maritime | microcircuit memory | 16236 | RFQ |
87C51 BQA | philips semiconductors ltd | microcircuit memory | 18324 | RFQ |
MD87C51 | intel corporation | microcircuit memory | 34649 | RFQ |
MD87C51 B | intel corporation | microcircuit memory | 7u050 | RFQ |
PL401D3000 ITEM NO. 23 | ems development corporation | microcircuit memory | 51435 | RFQ |
ROM PROM HEAD 253 | dla land and maritime | microcircuit memory | 16236 | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 2.096 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.510 INCHES MINIMUM AND 0.620 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BURN IN AND MONOLITHIC AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-5 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.0 VOLTS MINIMUM POWER SOURCE AND 13.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | EPROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 40 PRINTED CIRCUIT |
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