| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-265-8171 (012658171) |
| NCB Code | USA (01) |
| Manufacturer | E2v Inc, Philips Semiconductors Ltd, Rockwell Collins Aerospace, Northrop Grumman Systems Corporation, Dla Land And Maritime, Intel Corporation, Rochester Electronics Llc, National Semiconductor Corporation, Leonardo Mw Ltd |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 27C64-20 YA | e2v inc | microcircuit memory | 0c7v7 | RFQ |
| 27C64A-BXA-20 | philips semiconductors ltd | microcircuit memory | 18324 | RFQ |
| 351-5744-062 | rockwell collins aerospace | microcircuit memory | 13499 | RFQ |
| 585R630H03 | northrop grumman systems corporation | microcircuit memory | 97942 | RFQ |
| 85102 | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 8510203YA | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 8510203YB | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 8510203YX | dla land and maritime | microcircuit memory | 67268 | RFQ |
| MD27C64 20 B | intel corporation | microcircuit memory | 34649 | RFQ |
| MD27C64-20 BYA | rochester electronics llc | microcircuit memory | 3v146 | RFQ |
| NMC27C64Q20 883 | national semiconductor corporation | microcircuit memory | 27014 | RFQ |
| ROM PROM HEAD 177 | dla land and maritime | microcircuit memory | 16236 | RFQ |
| VA-85-0708-001 | leonardo mw ltd | microcircuit memory | k0668 | RFQ |
| VA-85-0708-004 | leonardo mw ltd | microcircuit memory | k0668 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 170.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -2.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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