| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-264-3011 (012643011) |
| NCB Code | USA (01) |
| Manufacturer | Hamilton Sundstrand Corporation, Dla Land And Maritime, Advanced Micro Devices Inc, Texas Instruments Inc, Mmi Amd |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 794952-1 | hamilton sundstrand corporation | microcircuit memory | 73030 | RFQ |
| 794952-1-0013 | hamilton sundstrand corporation | microcircuit memory | 73030 | RFQ |
| 81036 | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 81036112A | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 81036112B | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 81036112X | dla land and maritime | microcircuit memory | 67268 | RFQ |
| AMPAL16L8L B2A | advanced micro devices inc | microcircuit memory | 34335 | RFQ |
| PAL16L8A-2MFKB | texas instruments inc | microcircuit memory | 01295 | RFQ |
| PAL16L8A-2ML 883B | mmi amd | microcircuit memory | 50364 | RFQ |
| PROM ROM HEAD 213 | dla land and maritime | microcircuit memory | 16236 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES FORWARD CURRENT,MAXIMUM PEAK TOTAL VALUE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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