| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-234-3569 (012343569) |
| NCB Code | USA (01) |
| Manufacturer | Alliant Techsystems Operations Llc, Intel Corporation, Lockheed Martin Corporation, Dla Land And Maritime, Advanced Micro Devices Inc |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 2612588-1 | alliant techsystems operations llc | microcircuit memory | 06424 | RFQ |
| 27128-2 | intel corporation | microcircuit memory | 34649 | RFQ |
| 3594-7159 | lockheed martin corporation | microcircuit memory | 08241 | RFQ |
| 3651-6037 | lockheed martin corporation | microcircuit memory | 08241 | RFQ |
| 82025 | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 8202503YA | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 8202503YB | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 8202503YX | intel corporation | microcircuit memory | 34649 | RFQ |
| 8202503YX | dla land and maritime | microcircuit memory | 67268 | RFQ |
| AM27128A 20 BXA | advanced micro devices inc | microcircuit memory | 34335 | RFQ |
| AM27128A-20DMB | advanced micro devices inc | microcircuit memory | 34335 | RFQ |
| MD27128-20-B | intel corporation | microcircuit memory | 34649 | RFQ |
| MD27128A-20B | intel corporation | microcircuit memory | 34649 | RFQ |
| ROM PROM HEAD 091 | dla land and maritime | microcircuit memory | 16236 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.485 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.590 INCHES MINIMUM AND 0.625 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.217 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | ALQ176 MLV |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 50.00 MILLIAMPERES NOMINAL TOTAL SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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