| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-199-7510 (011997510) |
| NCB Code | USA (01) |
| Manufacturer | Raytheon Company, Bae Systems Inc, Edo Corp, Hamilton Sundstrand Corporation, Bae Systems Information, Honeywell International Inc, Dla Land And Maritime, Seeq Technology Inc, Intel Corporation, Eldec Corporation |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 2690986-1 | raytheon company | microcircuit memory | 96214 | RFQ |
| 312342-001 | bae systems inc | microcircuit memory | 81413 | RFQ |
| 433486-77 | edo corp | microcircuit memory | 00752 | RFQ |
| 577 36 | hamilton sundstrand corporation | microcircuit memory | 73030 | RFQ |
| 5E8077 36 | hamilton sundstrand corporation | microcircuit memory | 73030 | RFQ |
| 6011485-001 | bae systems information | microcircuit memory | 12436 | RFQ |
| 6404238-1 | honeywell international inc | microcircuit memory | 55974 | RFQ |
| 82025 | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 8202502YA | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 8202502YB | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 8202502YX | dla land and maritime | microcircuit memory | 67268 | RFQ |
| DM27128-250 | seeq technology inc | microcircuit memory | 61394 | RFQ |
| DM27128-251B | seeq technology inc | microcircuit memory | 61394 | RFQ |
| MD27128 25 B | intel corporation | microcircuit memory | 34649 | RFQ |
| ROM PROM HEAD 191 | dla land and maritime | microcircuit memory | 16236 | RFQ |
| UM23-02 | eldec corporation | microcircuit memory | 08748 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.217 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 50.00 MILLIAMPERES NOMINAL SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| Components Related to NSN - 5962-01-199-7510, 5962011997510 | ||||
| 5999-01-481-1051 (5999014811051) | 5995-01-569-3777 (5995015693777) | 5998-00-302-2814 (5998003022814) | 5930-00-422-0534 (5930004220534) | |
| 5998-01-289-0549 (5998012890549) | 5962-00-274-2396 (5962002742396) | 5962-01-093-6792 (5962010936792) | 5930-01-169-8149 (5930011698149) | |
| 5940-01-042-9428 (5940010429428) | 5910-01-624-2225 (5910016242225) | 5998-01-456-1741 (5998014561741) | 5935-00-020-7903 (5935000207903) | |
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