| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-192-0210 (011920210) |
| NCB Code | USA (01) |
| Manufacturer | Lockheed Martin Corporation, Hitachi Kokusai Electric America, St Microelectronics Ltd |
| MRC | Criteria | Characteristic |
|---|---|---|
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| ADAQ | BODY LENGTH | 31.75 MILLIMETERS NOMINAL |
| ADAT | BODY WIDTH | 14.66 MILLIMETERS NOMINAL |
| ADAU | BODY HEIGHT | 5.51 MILLIMETERS MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | 0.0 TO 70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH SPEED AND LOW POWER AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| Components Related to NSN - 5962-01-192-0210, 5962011920210 | ||||
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| 5970-01-146-4146 (5970011464146) | 5975-01-393-2233 (5975013932233) | 5999-01-420-7755 (5999014207755) | 5910-00-826-2725 (5910008262725) | |
| 5998-01-303-6935 (5998013036935) | 5935-01-273-2470 (5935012732470) | 5935-01-172-3967 (5935011723967) | 5999-01-176-2149 (5999011762149) | |
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