| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-163-4168 (011634168) |
| NCB Code | USA (01) |
| Manufacturer | Boeing Company The, Raytheon Technical Services Company, L 3 Communications Corporation, Fairchild Semiconductor Corp, Intel Corporation, Intersil Communications Inc, Intersil Corporation, Mmi Amd, Philips Semiconductors Ltd, Texas Instruments Inc |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 000-8002-348 | boeing company the | microcircuit memory | 94756 | RFQ |
| 4014312-01 | raytheon technical services company | microcircuit memory | 36378 | RFQ |
| 4014312-01 | l 3 communications corporation | microcircuit memory | 1pqf4 | RFQ |
| 4014726-124 | l 3 communications corporation | microcircuit memory | 1pqf4 | RFQ |
| 4014726-124 | raytheon technical services company | microcircuit memory | 36378 | RFQ |
| 93453DC | fairchild semiconductor corp | microcircuit memory | 07263 | RFQ |
| D3625-2 | intel corporation | microcircuit memory | 34649 | RFQ |
| HM1-7643-5 | intersil communications inc | microcircuit memory | 1my79 | RFQ |
| HM1-7643-5 | intersil corporation | microcircuit memory | 34371 | RFQ |
| MM6353-1J | mmi amd | microcircuit memory | 50364 | RFQ |
| N82S137F | philips semiconductors ltd | microcircuit memory | 18324 | RFQ |
| SK010296 | raytheon technical services company | microcircuit memory | 36378 | RFQ |
| SN74S476J | texas instruments inc | microcircuit memory | 01295 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | 0.0/75.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| Components Related to NSN - 5962-01-163-4168, 5962011634168 | ||||
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| 5940-00-615-5893 (5940006155893) | 5998-00-297-6935 (5998002976935) | 5950-00-646-2937 (5950006462937) | 5961-00-228-5860 (5961002285860) | |
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