MRC | Criteria | Characteristic |
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ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.135 INCHES MINIMUM AND 0.150 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | 5820-01-102-3921 80058 |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH VOLTAGE AND MEDIUM SPEED AND HIGH IMPEDANCE |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 GATE,COMPLEMENTARY PAIR AND 3 INVERTER |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | MO-001-AB JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 20.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |