| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-135-5706 (011355706) |
| NCB Code | USA (01) |
| Manufacturer | Raytheon Technical Services Company, Ogden Air Logistics Center, Advanced Micro Devices Inc |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 8071825-007 | raytheon technical services company | microcircuit memory | 36378 | RFQ |
| 8071825-007 | ogden air logistics center | microcircuit memory | 98747 | RFQ |
| AM27S185ADC | advanced micro devices inc | microcircuit memory | 34335 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.870 INCHES MINIMUM AND 0.920 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.200 INCHES MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BIPOLAR AND HIGH SPEED AND PROGRAMMABLE AND SCHOTTKY" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| CZER | MEMORY DEVICE TYPE | ROM" |
| CZZZ | MEMORY CAPACITY | UNKNOWN" |
| TEST | TEST DATA DOCUMENT | 98747-8071825 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAW" |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT" |
| ADAQ | BODY LENGTH | 0.870 INCHES MINIMUM AND 0.920 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.200 INCHES MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BIPOLAR AND HIGH SPEED AND PROGRAMMABLE AND SCHOTTKY" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| CZER | MEMORY DEVICE TYPE | ROM" |
| CZZZ | MEMORY CAPACITY | UNKNOWN" |
| TEST | TEST DATA DOCUMENT | 98747-8071825 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAW" |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT" |
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