| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-123-4780 (011234780) |
| NCB Code | USA (01) |
| Manufacturer | Mmi Amd, Advanced Micro Devices Inc, Raytheon Company, Fairchild Semiconductor Corp, Intersil Corporation, Dla Land And Maritime |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 18532 | mmi amd | microcircuit memory | 50364 | RFQ |
| 27S33 | advanced micro devices inc | microcircuit memory | 34335 | RFQ |
| 5353-1F | mmi amd | microcircuit memory | 50364 | RFQ |
| 53S441-F | mmi amd | microcircuit memory | 50364 | RFQ |
| 932883-373 | raytheon company | microcircuit memory | 82577 | RFQ |
| 93453 | fairchild semiconductor corp | microcircuit memory | 07263 | RFQ |
| B1614-1B | intersil corporation | microcircuit memory | 34371 | RFQ |
| B2052-373 | intersil corporation | microcircuit memory | 34371 | RFQ |
| DH75699 | advanced micro devices inc | microcircuit memory | 34335 | RFQ |
| HL42543 | fairchild semiconductor corp | microcircuit memory | 07263 | RFQ |
| HM7643 | intersil corporation | microcircuit memory | 34371 | RFQ |
| HM9-7643-B2052-373 | intersil corporation | microcircuit memory | 34371 | RFQ |
| HR10731 | fairchild semiconductor corp | microcircuit memory | 07263 | RFQ |
| MM5353 | mmi amd | microcircuit memory | 50364 | RFQ |
| ROM PROM FAMILY 017 | dla land and maritime | microcircuit memory | 16236 | RFQ |
| SD948 | mmi amd | microcircuit memory | 50364 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.090 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 175.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND BURN IN,MIL-STD-883,CLASS B AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER OR GOLD |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACE GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TEST | TEST DATA DOCUMENT | 82577-932883 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |
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