| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-120-1249 (011201249) |
| NCB Code | USA (01) |
| Manufacturer | Fairchild Semiconductor Corp, L 3 Communications Corporation, Raytheon Technical Services Company, Intel Corporation, National Semiconductor Corporation, Intersil Corporation, Mmi Amd, Philips Semiconductors Ltd |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 29661DC | fairchild semiconductor corp | microcircuit memory | 07933 | RFQ |
| 4004004-01 | l 3 communications corporation | microcircuit memory | 1pqf4 | RFQ |
| 4004004-01 | raytheon technical services company | microcircuit memory | 36378 | RFQ |
| 4014589-001 | l 3 communications corporation | microcircuit memory | 1pqf4 | RFQ |
| 4014589-001 | raytheon technical services company | microcircuit memory | 36378 | RFQ |
| 93427DC | fairchild semiconductor corp | microcircuit memory | 07263 | RFQ |
| D3621-1 | intel corporation | microcircuit memory | 34649 | RFQ |
| DM74S287J | national semiconductor corporation | microcircuit memory | 27014 | RFQ |
| HM1-7611-5 | intersil corporation | microcircuit memory | 34371 | RFQ |
| MM6301-1J | mmi amd | microcircuit memory | 50364 | RFQ |
| N82S129F | philips semiconductors ltd | microcircuit memory | 18324 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.790 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | 0.0/75.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | A/F37A-T36 FSCM 22903 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/BUFFERED OUTPUT AND W/DISABLE AND W/OPEN COLLECTOR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 9 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 22903-4014589-001 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| Components Related to NSN - 5962-01-120-1249, 5962011201249 | ||||
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| 5940-01-264-7111 (5940012647111) | 5905-01-342-3348 (5905013423348) | 5960-00-995-5932 (5960009955932) | 5910-00-469-3009 (5910004693009) | |
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