| Item Name | Microcircuitmemory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-079-7736 (010797736) |
| NCB Code | USA (01) |
| Manufacturer | Hewlett-Packard Company, Bae Systems Inc, Intel Corporation, Raytheon Company, Advanced Micro Devices Inc, Dla Land And Maritime, Fairchild Semiconductor Corp, National Semiconductor Corporation, Philips Semiconductors Ltd |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 1818-1756 | hewlett-packard company | microcircuitmemory | 28480 | RFQ |
| 202340-001 | bae systems inc | microcircuitmemory | 81413 | RFQ |
| 202340-001 | intel corporation | microcircuitmemory | 34649 | RFQ |
| 341844-1 | raytheon company | microcircuitmemory | 96214 | RFQ |
| 906745-103 | raytheon company | microcircuitmemory | 49956 | RFQ |
| 9102DDC | advanced micro devices inc | microcircuitmemory | 34335 | RFQ |
| 9102DM B | advanced micro devices inc | microcircuitmemory | 34335 | RFQ |
| AM9102DM | advanced micro devices inc | microcircuitmemory | 34335 | RFQ |
| DMS 84006B | dla land and maritime | microcircuitmemory | 16236 | RFQ |
| HL31687 | fairchild semiconductor corp | microcircuitmemory | 07263 | RFQ |
| MD2102A 6B | intel corporation | microcircuitmemory | 34649 | RFQ |
| MD2102A-6 | intel corporation | microcircuitmemory | 34649 | RFQ |
| MM2102AJ6L | national semiconductor corporation | microcircuitmemory | 27014 | RFQ |
| MM2102J 883B | national semiconductor corporation | microcircuitmemory | 27014 | RFQ |
| RBX2102F | philips semiconductors ltd | microcircuitmemory | 18324 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND W/DECODED OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 650.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 650.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 81413-202340 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| Components Related to NSN - 5962-01-079-7736, 5962010797736 | ||||
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| 5998-01-670-0290 (5998016700290) | 5905-01-099-4430 (5905010994430) | 5930-01-046-8141 (5930010468141) | 5995-01-460-6411 (5995014606411) | |
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