Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-076-8405 (010768405) |
NCB Code | USA (01) |
Manufacturer | Mmi Amd, Raytheon Company, Intersil Communications Inc, Intersil Corporation, Philips Semiconductors Ltd, Advanced Micro Devices Inc, Fairchild Semiconductor Corp, Dla Land And Maritime, Texas Instruments Inc |
Part Number | Manufacturer | Item Name | Cage Code | RFQ |
---|---|---|---|---|
17640 | mmi amd | microcircuit memory | 50364 | RFQ |
932820-5 | raytheon company | microcircuit memory | 82577 | RFQ |
B2054-5 | intersil communications inc | microcircuit memory | 1my79 | RFQ |
B2054-5 | intersil corporation | microcircuit memory | 34371 | RFQ |
CC5193-5 | philips semiconductors ltd | microcircuit memory | 18324 | RFQ |
DH75681-5 | advanced micro devices inc | microcircuit memory | 34335 | RFQ |
HM9-7611-2 | intersil corporation | microcircuit memory | 34371 | RFQ |
HR10805 | fairchild semiconductor corp | microcircuit memory | 07263 | RFQ |
MM5301-1F | mmi amd | microcircuit memory | 50364 | RFQ |
ROM PROM FAMILY 015 | dla land and maritime | microcircuit memory | 16236 | RFQ |
S82S129W | philips semiconductors ltd | microcircuit memory | 18324 | RFQ |
SN54S287W | texas instruments inc | microcircuit memory | 01295 | RFQ |
SN92786W | texas instruments inc | microcircuit memory | 01295 | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.325 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 910.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND 3-STATE OUTPUT AND SCHOTTKY AND HIGH SPEED AND EXPANDABLE AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND W/ENABLE AND W/DI |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 82577-932820 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
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