Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-068-3319 (010683319) |
NCB Code | USA (01) |
Manufacturer | Harris Technical Services Corp, National Semiconductor Corporation, Harris Corporation, Intersil Corporation, Dla Land And Maritime, Philips Semiconductors Ltd |
Part Number | Manufacturer | Item Name | Cage Code | RFQ |
---|---|---|---|---|
247ASC2520-019 | harris technical services corp | microcircuit memory | 0c9d4 | RFQ |
DM7574J 883C | national semiconductor corporation | microcircuit memory | 27014 | RFQ |
HPR0M-1-1024-8 | harris corporation | microcircuit memory | 91417 | RFQ |
HPR0M-1-1024-8 | intersil corporation | microcircuit memory | 34371 | RFQ |
ROM/PROM FAMILY 005 | dla land and maritime | microcircuit memory | 16236 | RFQ |
S82S129F 883C | philips semiconductors ltd | microcircuit memory | 18324 | RFQ |
TM5623MDE 883C | intersil corporation | microcircuit memory | 32293 | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.815 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.185 INCHES NOMINAL |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND 3-STATE OUTPUT |
CQSJ | INCLOSURE MATERIAL | CERAMIC OR GLASS OR METAL |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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