| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-047-2035 (010472035) |
| NCB Code | USA (01) |
| Manufacturer | Interlink Communications Inc, Northrop Grumman Systems Corporation, Lockheed Martin Corporation, Texas Instruments Inc, Nec Electronics Usa Inc, Intel Corporation, Freescale Semiconductor Inc, Dla Land And Maritime |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 40-018015-01 | interlink communications inc | microcircuit memory | 30890 | RFQ |
| 989C289H01 | northrop grumman systems corporation | microcircuit memory | 18323 | RFQ |
| C8857-1 | lockheed martin corporation | microcircuit memory | 81755 | RFQ |
| CCA3329 | texas instruments inc | microcircuit memory | 01295 | RFQ |
| EA2708-6 | nec electronics usa inc | microcircuit memory | 33297 | RFQ |
| H8708 | intel corporation | microcircuit memory | 34649 | RFQ |
| MC2708 B | intel corporation | microcircuit memory | 34649 | RFQ |
| MCM2708BJBJC | freescale semiconductor inc | microcircuit memory | 04713 | RFQ |
| MD2708 B | intel corporation | microcircuit memory | 34649 | RFQ |
| ROM PROM FAMILY 014 | dla land and maritime | microcircuit memory | 16236 | RFQ |
| SCM37502L | freescale semiconductor inc | microcircuit memory | 04713 | RFQ |
| TMS2708-45JDL | texas instruments inc | microcircuit memory | 01295 | RFQ |
| ZA0700JM | texas instruments inc | microcircuit memory | 01295 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.200 INCHES MINIMUM AND 1.300 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.320 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND HIGH SPEED AND 3-STATE OUTPUT AND PROGRAMMABLE AND W/DECODED OUTPUT AND W/BUFFERED OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND METAL |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 15.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| Components Related to NSN - 5962-01-047-2035, 5962010472035 | ||||
| 5925-01-622-1713 (5925016221713) | 5950-00-224-8269 (5950002248269) | 5999-00-940-2834 (5999009402834) | 5945-00-963-1183 (5945009631183) | |
| 5940-00-615-5893 (5940006155893) | 5998-00-297-6935 (5998002976935) | 5950-00-646-2937 (5950006462937) | 5961-00-228-5860 (5961002285860) | |
| 5935-01-107-8942 (5935011078942) | 5945-01-131-3787 (5945011313787) | 5998-01-373-2457 (5998013732457) | 5950-01-276-8859 (5950012768859) | |
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