| Item Name | Semiconductor Device Diode |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5961 Semiconductor Devices and Associated Hardware |
| National Item Identification Number (NIIN) | 01-165-5170 (011655170) |
| NCB Code | USA (01) |
| Manufacturer | Fei Microwave Inc, Micrometrics Inc, Semi General Inc |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.050 INCHES MAXIMUM |
| ADAV | OVERALL DIAMETER | 0.055 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | PRESS FIT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 3.0 MINIMUM BREAKDOWN VOLTAGE,DC |
| CTRD | POWER RATING PER CHARACTERISTIC | 100.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 0.08 NOMINAL |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| Components Related to NSN - 5961-01-165-5170, 5961011655170 | ||||
| 5999-01-481-1051 (5999014811051) | 5995-01-569-3777 (5995015693777) | 5998-00-302-2814 (5998003022814) | 5930-00-422-0534 (5930004220534) | |
| 5998-01-289-0549 (5998012890549) | 5962-00-274-2396 (5962002742396) | 5962-01-093-6792 (5962010936792) | 5930-01-169-8149 (5930011698149) | |
| 5940-01-042-9428 (5940010429428) | 5910-01-624-2225 (5910016242225) | 5998-01-456-1741 (5998014561741) | 5935-00-020-7903 (5935000207903) | |
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