Item Name | Semiconductor Device Diode |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5961 Semiconductor Devices and Associated Hardware |
National Item Identification Number (NIIN) | 01-088-1530 (010881530) |
NCB Code | USA (01) |
Manufacturer | Nimikkeistokeskus Ncb Finland, Electronic Industries Inc, General Semiconductor Inc, Rockwell Collins Aerospace, Bae Systems Inc, G E C Marconi Defence Systems Ltd, Northrop Grumman Systems Corporation, Thales Defense And Security Inc, Military Specifications |
Part Number | Manufacturer | Item Name | Cage Code | RFQ |
---|---|---|---|---|
10389044 | nimikkeistokeskus ncb finland | semiconductor device diode | a486g | RFQ |
1N5639 | electronic industries inc | semiconductor device diode | 80131 | RFQ |
1N5639 | general semiconductor inc | semiconductor device diode | 24444 | RFQ |
353-9016-840 | rockwell collins aerospace | semiconductor device diode | 13499 | RFQ |
415 4 05872 639 | bae systems inc | semiconductor device diode | k1156 | RFQ |
415-4-05872-639 | g e c marconi defence systems ltd | semiconductor device diode | k6036 | RFQ |
944467-6391 | northrop grumman systems corporation | semiconductor device diode | 06481 | RFQ |
JANTX1N5639A | thales defense and security inc | semiconductor device diode | 65597 | RFQ |
JANTX1N5639A | military specifications | semiconductor device diode | 81349 | RFQ |
JTX1N5639A | military specifications | semiconductor device diode | 81349 | RFQ |
MIL-PRF-19500/500 | military specifications | semiconductor device diode | 81349 | RFQ |
MIL-S-19500/500 | military specifications | semiconductor device diode | 81349 | RFQ |
RELEASE 6049 | electronic industries inc | semiconductor device diode | 80131 | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 0.293 INCHES MINIMUM AND 0.357 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM AND 1.625 INCHES MAXIMUM |
ADAV | OVERALL DIAMETER | 0.215 INCHES MINIMUM AND 0.235 INCHES MAXIMUM |
AXGY | MOUNTING METHOD | TERMINAL |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 17.1 MINIMUM BREAKDOWN VOLTAGE,DC AND 18.9 MAXIMUM BREAKDOWN VOLTAGE,DC AND 15.3 MAXIMUM WORKING PEAK REVERSE VOLTAGE |
CTQX | CURRENT RATING PER CHARACTERISTIC | 5.00 MICROAMPERES MAXIMUM REVERSE CURRENT,DC |
CTRD | POWER RATING PER CHARACTERISTIC | 1.0 WATTS MAXIMUM AVERAGE ON-STATE POWER DISSIPATION |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 DEG CELSIUS JUNCTION |
MATT | MATERIAL | GLASS INCLOSURE |
MATT | MATERIAL | SILICON SEMICONDUCTOR |
TEST | TEST DATA DOCUMENT | 81349-MIL-S-19500 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-S-19500/500 GOVERNMENT SPECIFICATION |
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