| Item Name | Semiconductor Device Diode |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5961 Semiconductor Devices and Associated Hardware |
| National Item Identification Number (NIIN) | 00-840-2890 (008402890) |
| NCB Code | USA (00) |
| Manufacturer | Northrop Grumman Systems Corporation, Avago Technologies Us Inc, Hewlett-Packard Company |
| MRC | Criteria | Characteristic |
|---|---|---|
| AXGY | MOUNTING METHOD | TERMINAL |
| ABHP | OVERALL LENGTH | 0.170 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.076 INCHES MAXIMUM |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 25.0 MAXIMUM BREAKDOWN VOLTAGE,COLLECTOR-TO-BASE,EMITTER OPEN |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS AMBIENT AIR |
| MATT | MATERIAL | GLASS INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 2.47 MILLIAMPERES MAXIMUM COLLECTOR CURRENT,DC |
| CTRD | POWER RATING PER CHARACTERISTIC | 125.0 MILLIWATTS MAXIMUM COLLECTOR POWER DISSIPATION |
| Components Related to NSN - 5961-00-840-2890, 5961008402890 | ||||
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| 5998-01-289-0549 (5998012890549) | 5962-00-274-2396 (5962002742396) | 5962-01-093-6792 (5962010936792) | 5930-01-169-8149 (5930011698149) | |
| 5940-01-042-9428 (5940010429428) | 5910-01-624-2225 (5910016242225) | 5998-01-456-1741 (5998014561741) | 5935-00-020-7903 (5935000207903) | |
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